Logout
Characteristics
Certification
EC
JEDEC standard
Yes
Compatible chipset
Intel® H81, Intel® H61 Express, Intel® G41 Express, Intel® H55 Express
Row cycle time
48,125 ns
Clock memory speed
1333 MHz
Memory bandwidth (max)
10.6 GB / s
RoHS accord
Yes
Active time in line
35 ns
CAS latency
9
Buffered memory type
Unregistered (unbuffered)
Memory voltage
1.5 V
Memory layout (modules x size)
1 x 2 GB
ECC
Not
Row cycle update time
260 ns
Internal memory
2 GB
Other features
Chip organization
x8 FBGA DRAM
Country of origin
China
Packaging
Package height
88 mm
Package width
168 mm
Package weight
37 g
Environmental conditions
Storage temperature range
-55 - 100 ° C
Operating temperature range
0 - 85 ° C
Weight and measurements
Weight
19 g
Height
30 mm
Width
133 mm
