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> Strumenti Attrezzi > Dispositivi > Programmazione&Cracking > CPU Heating Glue Removal Table Mijing MS1 Mini
CPU Heating Glue Removal Table Mijing MS1 Mini
CPU Heating Glue Removal Table Mijing MS1 Mini
Mijing MS1 Mini CPU Heating Module is a practical and efficient solution for electronic repairs, eliminating the need for
a traditional hot air gun or soldering station. Easy to use, the module allows fast heating with a single-button adjustable
temperature range from 160 degrees to 250 degrees C. It features a hidden-screw heating system and a low-voltage
heating plate, supporting 5V or 9V power input. The aluminum substrate ensures fast and efficient heat dissipation,
enhancing overall performance. The MS1 Mini is ideal for removing adhesive and solder from CPU, RAM, eMMC,
SSD, WiFi, and other electronic components. Its compact and portable design makes it easy to use anywhere.
Specifications:
- No hot air gun or soldering station needed - simple operation
- Fast heating, adjustable temperature from 160 degrees to 250 degrees C via a single button
- Hidden screws, low-voltage heating plate, supports 5V/9V input
- Aluminum substrate for fast and efficient heat dissipation
- Suitable for removing adhesive and solder from CPU, RAM, eMMC, SSD, WiFi, and more
- Compact and portable, easy to use anywhere
