0038651205458
Tutte le categorie
0
Logout
La tua posizione: Home > Strumenti Attrezzi > Attrezzi > Chip saldatura > Chip saldatura Altro Android > Wylie WL-59 BGA Reballing Stencil For OPPO R9 R9S Plus/ VIVO X6 X7 X9 WCN3615 BQ24296M PMI8952 PM8956 CPU Power IC Chip
Got Questions ? Contact Us!
WHATSAPP
0038651205458

Wylie WL-59 BGA Reballing Stencil For OPPO R9 R9S Plus/ VIVO X6 X7 X9 WCN3615 BQ24296M PMI8952 PM8956 CPU Power IC Chip

Descrizione:

Wylie WL-59 BGA Reballing Stencil For OPPO R9 R9S Plus/ VIVO X6 X7 X9 WCN3615 BQ24296M PMI8952 PM8956 CPU Power IC Chip Tin Net