>
Strumenti Attrezzi >
Attrezzi >
Chip saldatura >
Chip saldatura Xiaomi >
Wylie WL-68 BGA Reballing Stencil For SM8150 PM8150 CPU RAM Power IC Chip Samsung S10 Xiaomi 9 LG V50 Vivo IQOO BGA153 O
Wylie WL-68 BGA Reballing Stencil For SM8150 PM8150 CPU RAM Power IC Chip Samsung S10 Xiaomi 9 LG V50 Vivo IQOO BGA153 OPM2622