0038651205458
简体中文 English Italiano
Tutte le categorie
0
Logout
La tua posizione: Home > Strumenti Attrezzi > Attrezzi > Chip saldatura > Chip saldatura Xiaomi > Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9/CC9e/8SE/A3/Redmi Note 8 BGA254 SDM665 SM6125/SDM710 CPU RAM Power WiFi
Got Questions ? Contact Us!
WHATSAPP
0038651205458
Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9/CC9e/8SE/A3/Redmi Note 8 BGA254 SDM665 SM6125/SDM710 CPU RAM Power WiFi

< >

Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9/CC9e/8SE/A3/Redmi Note 8 BGA254 SDM665 SM6125/SDM710 CPU RAM Power WiFi

Descrizione:

Wylie WL-71 BGA Reballing Stencil For Xiaomi CC9/CC9e/8SE/A3/Redmi Note 8 BGA254 SDM665 SM6125/SDM710 CPU RAM Power WiFi IC Chip


Prodotti in relazione