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> Strumenti Attrezzi > Attrezzi > Chip saldatura > Chip saldatura Apple > Multifunctional Positioning Pressure-Reducing Protective Pad For BGA Repairing
Multifunctional Positioning Pressure-Reducing Protective Pad For BGA Repairing
BGA Chips Repairing Pressure-Reducing Protecting Pad
Product Detail:
Silicone material resistant to high temperature
Specifically designed for repairing BGA chips of electronic products
Effectively avoid tin messing caused by the deformation of steel mesh
Multiple component slots
Product Pack:
Magic Pad*1
