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> Strumenti Attrezzi > Attrezzi > Lame > Mechanic 004 Adhesive Cutting Blade Set For BGA Chip
Mechanic iBlade 004 Blades Set with 4 kinds steel blades, Phone BGA CPU / IC / eMMC / NAND Degumming prying tool, Mechanic 004 Blades Set for iphone CPU IC Chip Degumming Tool Set
Mechanic 004 Blades Set Phone BGA Chip Degumming prying tool
Product Function :
Crescent Knife for iPhone A8 A9 A10 A11 A12 CPU BGA chip.
Crooked Knife Disassemble Cleaning Pry tool for mobile phone motherboard sealant glue.
UV Glue Cleaning Tool and crooked shovel Knife for Removing the motherboard sealant glue.
Solder Paste Scraping Knife for cell Phone BGA Repair and UV Glue Cleaning Tool.
Product Features :
Handmade sharpening and grinding : Pure manual cutting edge grinding
Real gold plating process : Standardized 5UM nickel layer process real gold plating molecular surface treatment anti-oxygen and anti-corrosion.
Special grade 4A material : Adopt 0.1mm imported AAAA steel, soft and tough, strong heat and wear resistance.
Non-slip fine lines design : 8mm diameter, comfortable grip, ergonomic design.
Double handle : Adopt 0.1mm imported AAAA steel, soft and tough, strong heat and wear resistance.
Product Specification :
Item name: Adhesive Cutter Blade
Brand: Mechanic
Model: 004
Package size: 170*80*20mm
Net weight: 48g
Usage: It is suitable for tapping, scraping, debonding disassembling the main board chip and laminating.
Widely used: Suitable for cutting, shoveling, removing glue disassembling motherboard chip layer, ect
Packing List :
1pc x Blade Handle
4pcs x Blades
